At the core of any micro/nanofabrication processing lie lithographic processes and SHyNE offers a wide array of patterning tools. From standard contact aligners to high throughput steppers and electron beam lithography (EBL) systems, we can pattern features from several nanometers to micrometers on a range of different substrates. Several unique capabilities include maskless laser aligners for direct patterning from digital patterns with sub-micron resolution, a focused ion beam (FIB) system with a sophisticated pattern generator and both SEM-based EBL for prototyping and dedicated, wafer-scale EBL.

Photolithography

• Contact aligners, I-line stepper, laser maskless aligners, UV flood exposure

Electron beam lithography

• SEM-based, dedicated beam writers

Focused ion beam lithography

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SHyNE facilities offer standard semiconductor thin film deposition for silicon, III-V and MEMS processing as well as novel, next-generation capabilities. These include multiple physical vapor deposition (PVD) systems for metal and dielectric deposition as well as reactive sputtering and co-sputtering capabilities. Chemical vapor deposition (CVD) processes allows for standard oxides, nitrides and amorphous silicon as well as low stress (LPCVD) nitride and stress-controlled silicon nitride (PECVD). In addition, both parylene coating and state-of-the-art atomic layer deposition (ALD) is available.

PVD

• Sputter coating, electron beam evaporation, thermal evaporation

CVD

• PECVD, LPCVD

Parylene coating

Atomic layer deposition

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Pattern transfer and substrate cleaning by dry etching is a key nano/microfabrication process. A number of different dry etch processes are available with chemistry compatible with silicon as well as III-V, MEMS and other processes. Hydrocarbon removal is also available by plasma ashers and oxygen RIE.

Reactive ion etching

• ICP Chlorine, ICP Fluorine

Deep RIE

Xenon difluoride etching

Plasma ashing

Downstream ashing

HF vapor etching

UV Ozone

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Several thermal processing capabilities are offered within SHyNE including state-of-the-art furnaces for oxidation and annealing processes and rapid thermal processing (RTP).

Furnaces, RTP

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Wet benches are available for a range of different processes including dedicated KOH, HF and TMAH capabilities. Critical point drying is also available as a release process for MEMS devices and ultra/megasonics baths are available for substrate cleaning.

KOH, HF, TMAH wet processing

Critical point drying

Ultra and megasonics

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In addition to front-end processing, SHyNE also offers capabilities for back-end processing including dicing, wire bonding and packaging.

Dicing saw

Vacuum packaging

Wire bonding

Wafer bonding

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